下載
下載

下載手冊、產品規格表、軟體等等:

下載類型
機型或關鍵字

What causes reflections in TDR?

問題:

What causes reflections in TDR?

答案:

The reflections that a TDR displays and measures are caused by changes in the impedance of the path of the step (circuit board, cable, or integrated circuit). Any significant change in impedance will cause a reflection. As an example, if an open solder connection exists on a circuit board, you can see that change with TDR. TDR also displays changes in the conductor resistance. For example, if there is corrosion in a joint and there is high resistance at that point, this is seen by a TDR. TDR also displays changes in capacitance.

If you think of the TDR display in terms of bumps and dips, it tends to make interpretation a lot easier. A bump (upward deflection) indicates a higher-impedance event, such as an open (see Figure 13) or a reduction in line width. A dip (downward deflection) indicates a lower-impedance event, such as a short or an increase in conductor width. The time location of the high-impedance event or low-impedance event as well as the delta times is displayed on screen.

Figure 13


此常見問答集適用於:

沒有任何產品系列

產品:

常見問答集 ID 57681

檢視所有常見問答集 »