高速串流列通訊

新一代的數位介面標準 (系列、記憶、顯示等) 迫使今日的相容性和偵錯工具本身限制面對多種高速 Tx 和 Rx 設計的問題,包括 -

  • 裝置外型縮小而造成存取訊號受限
  • 具備全新省電特性的匯流排行為
  • 使用訊號介面來驗證新訊號編碼和等化的功能
  • 備有多種電子驗證測試方法,為您省下更多時間!

Tektronix 提供可縮短 PHY 驗證週期,並確保一致性的自動化量測套件。若相容性量測失敗,也能利用通訊通訊協定解碼,和視覺觸發等工具加快偵錯速度。從像是串流音或其他多線道雜訊耦合等,來源識別抖動與雜訊。

標準和技術

資料庫

Title
PCI Express® 發射器 PLL 測試 - 方法比較

執行 PLL 測試的顯著方法概述

Probing Tips for High Performance Design and Measurement

Learn how to identify common signal integrity problems experienced in high speed and mobile designs, modeling techniques used to study and de-embed the effects of probing, probing considerations for low power circuits and much more in this detailed application note for high performance designs.

High Speed Interface StandardsThis e-Guide will help you learn more about design challenges for testing PCIe 4.0, SAS, SuperSpeed USB, and DDR4 standards. Within the pages of the eGuide you will also get quick access to technical resources that will help you understand design challenges and pick the right solution for your test needs.
Remote Head Acquisition Improves High Speed Serial Measurement

Learn how to maximize the margin in your signal integrity measurements.

快速有效的 DVI 相容性量測挑戰解決方案

Tektronix 提供了所有您需要的 DVI 量測解決方案,從探測用的高頻寬數位螢光示波器 (DPO),到特定應用軟體。Tektronix 解決了如抖動和眼狀圖測試等棘手的量測問題,打要可自動化和簡化您工作的 DVI 解決方案。

以 16G 光纖通道速率分析 SFP + 收發器的特性

針對 16G 光纖通道標準測試  SFP+ 收發器所需要的量測。

Testing your High Definition embedded devices using the HDMI Version 1.3 specification

Watch this video to get an overview of the new Link Training Tool, which forms…

1:31

Tackle today's high-speed serial signals and tomorrow's too with the scalable…

2:04

Tektronix supports many applications where AWGs are heavily used with plug-ins…

26:01

The Tektronix P7700 TriMode Probe supports solder connections to a device under…

5:58

The NEW P7700 Series TriMode Probe provides the highest probe fidelity available…

0:54

This webinar provides insight into the future of mobile device design and test,…

54:10
Title
Demystify MIPI D-PHY and C-PHY Transmitter and Receiver Physical Layer Test

During this webinar, you'll gain an understanding of MIPI test challenges for both MIPI high-speed physical layers and useful tips and technical insights into characterizing and validating design compliance.

How to Address Your Toughest Serial Bus Design Challenges with EDA and Measurement Correlation

This Tektronix webinar will teach engineers how to use modeling tools to correlate simulations with high-speed physical layer measurements on Serial Bus Standards using the DPO/MSO70000 Series Oscilloscopes.

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