Protecting Parametric Test Systems and the Test Environment from Damaging Transient Overvoltages and Overcurrents

Measuring breakdown parameters is increasingly required to predict a device’s safe region of operation. Sometimes, those breakdown conditions in reliability testing and breakdown test occur as a result of unexpected behaviors, such as a second breakdown. Physical damage to the test environment, such as a wafer burn mark, a melted probe-card needle, or other equipment damage, can also lead to breakdown problems. This application note outlines the various causes of these unexpected behaviors and how to prevent them.